Business in
a new way

Electronics contract manufacturing

The production is based in Shenzhen city, one of the world's largest electronics centers. There are thousands of enterprises for the production of components and assembly of finished products in Shenzhen and its environs. The region combines an up-to-date production base and high technology.

We guarantee strict quality requirements, highly qualified personnel, production on the most advanced equipment and highest level of organization.


2600 sq.m: 800 sq.m SMT, 1000 sq.m for DIP, other are office


The office consists of departments:

  • Engineering Department;
  • Quality Control Department;
  • Material Base Department;
  • Supply and Logistics Department.


The factory employs engineers, FQC specialists and workers.

For 2021-2022, there are no complaints about the quality of the supplied components!



High-quality work of managers, engineers, workers


Personal staff of quality control specialists


Production linesin China


Direct contracts with the largest component distributors


Quality control on the output line


Personal logistics


Every customer is important to us, so we are open to cooperation and long-term partnership


1. Preparatory stage. It is carried out using an automated optical verification system. During the verification process, the following defects are excluded: absence, shift, displacement of the component, violation of the polarity of the component, non-soldering, raising the chip, raising the solder, not inserted component.

2. Production and verification of pilot samples. After agreeing on the cost and technical parameters of the order, we proceed to the production of pilot images in order to check the compliance of all product parameters with the customer's technical task by the example of their work.

3. Manufacture of boards and purchase of equipment. After confirming the quality and completeness of the images, the production of boards and the purchase of equipment for the production of the series begins. During the production of boards, preparatory engineering processing of documentation is carried out by the company's employees. All necessary equipment is purchased directly from an official distributor.

4. Installation of the product. Upon the availability of a complete list of product nomenclature in our warehouses, the installation of the project is launched.

5. Soldering quality testing. It is carried out using an automated optical verification system. During the verification process, the following defects are excluded: absence, shift, displacement of the component, violation of the polarity of the component, non-soldering, raising the chip, raising the solder, not inserted component.

6. Functional testing. It is carried out at the request of the customer. This type of testing requires a functional control program that fully or partially duplicates the functionality of the module. When carrying out functional control, the customer receives 100% working products with guaranteed absence of defects. If necessary, the testing program can be written by our engineering staff.

7. Delivery. The company has various delivery methods. The method of delivery of each specific product is determined depending on the time, cost and territorial location of the customer.


Contract manufacturing frees up the time of your engineering and technical staff to solve tasks that are strategically important for the company's development: the development and launch of new products on the market, the promotion of existing product lines, the development of new promising sales channels and communication with potential customers.

The transfer of electronic modules for mass-produced products makes it possible to reduce investment costs for the purchase of equipment for installation, quality control of the solder joint and output control of the assembled product.

Transferring the process of ordering and manufacturing boards, purchasing and input control of components, installation, testing and output control of the finished electronic module to an outsourcing company significantly reduces your financial and time costs for the production of serial products that have constant demand in the market.


  • Lead and lead-free soldering of elements
  • SMD and DIP mounting
  • Installation of the BGA type housing
  • Mounting on flexible printed circuit boards
  • Mounting on aluminum boards
  • Manufacture of cables, cable assemblies and loops
  • Assembly of products into the housing


Personal assembly production allows you to fully control the quality of output products, flexibly adjust functional and optical testing programs and promptly make changes to the schedule of finished products

Full-automatic paste printing MPM, GKG (MPM UP-2000, G53G)
  • The minimum size of the printing area is 50.8mm x 50.8mm
  • The maximum size of the printing area is 457.2 mm x 406.4mm, or 508mm x 406.4 mm (using holders)
  • The cycle time per printed circuit board is less than 11 seconds
  • The accuracy of the combination of the printed circuit board and the stencil is 1 micron@ 6 sigma
  • Advanced algorithms for recognizing reference points
  • Maximum board size 457 x 356 mm
  • Minimum board size -80 x 60 mm
  • Board thickness from 0.3 mm to 4 mm
  • Number of 8mm tape denominations - up to 140 pcs
  • The loading time of the printed circuit board is 0.7 seconds
  • Performance - 40,000 components per hour
  • Installed components 0402...19 x 20mm
  • (height no more than 6 mm)
  • Mounting accuracy ± 0.01 mm
Universal SMT SAMSUNG (Cp45), HITACHI (GXH-1S, GXH-3), FUJI (XP-243E)
  • The maximum size of the printed circuit board: 460 x 400 mm
  • The thickness of the printed circuit board: 0.4-4.2 mm
  • The capacity of the feeder: 104 x 8mm
  • Rated capacity: 14900 CPH (components per hour)
  • Maximum installation speed: 0.178 seconds
  • Mounting accuracy (0603.0201): ±0.08mm (3 sigma)
Reflow oven JinTuo (AS-800X-8, JTE-1000, RO-TEA-1200D)
  • 8 pairs of upper and lower heating zones, 2 independent cooling zones using four inverters
  • Windows XP user interface
  • Electronic width adjustment rai
  • Standard chain and tape
  • Lead-free solder paste
  • Automatic overheating alarm
  • Temperature control using PID+SSR
  • High precision
  • Japan Temperature control Module (YAMATAKE)

Scope of application: it is used to check the quality of assembly and installation of SMD and DIP components. Checking the form and the presence of installed components. Inspection of the quality of solder paste application before and after melting of printed circuit boards in the furnace. Inspection of double-sided printed circuit boards. Can inspect several printed circuit boards at the same time. Control of the absence of foreign objects on the surface of printed circuit boards (solder balls, excess components). Control of the position of the components.

Conveyor furnace for soldering components RiDong Reflow oven (RF-8820PC-8)

The device is designed for soldering components on single-sided and double-sided printed circuit boards, by conveyor method, both with lead-free type of solder paste and with ordinary soldering. High heat capacity and thermal efficiency allows installation of CSP, BGA components. The upper and lower autonomous heating ensure temperature stability in the chamber.

Labocon Ultrasonic Cleaner (LUC-101, LUC 100)

The Labocon ultrasonic cleaner is designed to provide powerful ultrasonic vibrations generated by mechanical vibration generators, leading to intensive cleaning of complex objects with the help of liquid placed in a container

Wave soldering machine (Single wave) SUNEAST, JT (MWSI, MPS-350-II)
Laser machine YUMING (MF-E-A)
Automated dispensing machine BMZK (BMD-250)
Automatic coating machine BMZK (BMS-200)
Carbon dioxide (Dry ICE) cleaning machine YTQ (A-KG4)
Microscope TONGHUI (AO-HD206)


Itrium boards are used in access control systems (ACS). The board is made using 2+N+2 Stacked Microvia technology (Type III) HDI in accordance with IPC-2226. Surface mounting of components is performed on both sides and output mounting on one side.

During manufacturing the board passes the following control stages:

  • input visual inspection of printed circuit boards in accordance with IPC-A-600;
  • output visual inspection of electronic assemblies in accordance with IPC-A-610;
  • functional testing, which checks the operability of electronic assemblies.



Home lighting

Home lighting

Commercial lighting

Commercial lighting

Car electrics

Car electrics



Specialized machinery

Specialized machinery

Fire fighting&Security systems

Fire fighting&Security systems

Electric vehicles

Electric vehicles



Flash memory&SSD

Flash memory&SSD

Flash memory&SSD